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This position is for a semiconductor unit process packaging engineer with a focus on processes related to electrical probing. The processing engineer will collaborate with engineers and scientists on a variety of electrical probers with optical laser capabilities. The candidate will be part of a team encompassing the IBM Microelectronics Research Lab (MRL), Albany Nanotech Lab (ANT), and the Quantum Assemble Lab (QAL). These facilities provide world class 200/300 mm wafer scale fabrication and packaging services to multiple clients including Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs.
- Familiarity with semiconductor and packaging processing, as well as characterization is essential.
- Capability of learning new processes and semiconductor probing, packaging, and characterization tools quickly is also key.
- Driving improvements with processes and tools through electrical test, inspection, and metrology, with a goal of tighter quality distribution, higher efficiency (throughput improvement) and greater yield.
- Familiarity with semiconductor and packaging processing related to electrical testing.
- Great manual dexterity for manipulating smaller mechanical parts. Computer programming skills such as Python.
- Good organizational, communication, and presentative skills are imperative.