The position is for a semiconductor process engineer with a focus on processes related to packaging bonding. The processing engineer will work with engineers and scientists on a wide variety of packaging bonding processes such as wafer-to-wafer and metal-to-metal bonding, injection molded solder (IMS), inspection, metrology, and wet-dry cleans. The candidate will be part of a team in the Microelectronics Research Laboratory (MRL), which provides world class 200 mm wafer scale fabrication services to multiple clients including Quantum Computing, Artificial Intelligence Center in Albany, government programs, as well as multiple Joint Development clients with projects in Health Care and Life sciences, and the Internet of Things.
- Familiarity with semiconductor processing and specifically bonding processes.
- Capability of learning new processes and semiconductor packaging tools quickly is also key.
- Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughout improvements) and greater yield.
- Familiarity with wafer-to-wafer, metal-to-metal bonding, and injection molded solder, as well as debonding techniques.
- Great manual dexterity for manipulating smaller mechanical parts.
- Good organizational, communication, and presentation skills.