IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.
Developers and Engineers at IBM Research play a pivotal role in advancing innovation by overseeing the design, construction, testing, and characterization of both hardware and software. This multifaceted responsibility spans from individual devices to system-level implementations. Our team is dedicated to enabling and supporting internal research initiatives, evaluating emerging technologies for their potential application in real-world products, and demonstrating the value of these technologies for IBM's businesses and strategic partners.
1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
1) Hands on experience in semiconductor 3D packaging technology,
2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,