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The position is for a semiconductor process engineer with a focus on processes related to package bonding. The processing engineer will collaborate with engineers and scientists on a wide variety of package bonding processes such as wafer-to-wafer bonding, compression bonding, inspection, metrology, and wet-dry cleans. The candidate will be part of a team encompassing the IBM Microelectronics Research Laboratory (MRL), Albany Nanotech Lab (ANT), and the Quantum Assemble Lab (QAL). These facilities provide world class 200/300 mm wafer scale fabrication services to multiple clients including Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs.
- Familiarity with semiconductor processing and specifically bonding processes.
- Capability of learning new processes and semiconductor packaging tools quickly is also key.
- Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughout improvements) and greater yield.
- Familiarity with wafer-to-wafer bonding and compression bonding, as well as debonding techniques.
- Great manual dexterity for manipulating smaller mechanical parts. Good organizational, communication, and presentation skills.