As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
The India System design team is responsible to own and deliver System design milestones for IBM POWER, Storage and mainframe platforms. The team collaborates with Global System design & development teams and stakeholders. As a Mechanical engineer with the IBM thermal design team, the candidate must have experience in mechanical design with 3D mechanical modelling, design for manufacturing, and product release process to join industry leading engineers in pioneering the future of high performance and high reliability mainframe solutions.
Challenges of high performance and high reliability server solutions include high density designs with complex system requirements that require creative solutions from our mechanical design team to optimize system designs. The candidate will work in a multi-functional environment where the requirements of thermal, acoustics, electro-magnetic compatibility (EMC), structural integrity, safety, industrial design, cost, performance, and functionality must all be satisfied to deliver a final solution. Working with a focused team, the candidate will develop the product design from concept through product release.
Primary responsibilities will be to develop mechanical models through engagement with the expanded team, rapid prototype critical hardware updates, release design changes to manufacturing, evaluate hardware for design improvements, and engage suppliers for the IBM Z mainframe.
Responsibilities
As a member of the Thermal design team, the responsibilities include
· Creation of Bill of Materials (BOM), product structures, engineering changes (EC)
· Working with multi-disciplinary engineering team to collaborate on development and definition of complex rack level integrated products with multiple compute, storage, and networking systems components.
· Interface with development, manufacturing, and compliance teams to enable fulfilment of complex rack level integrated products out of IBM manufacturing division.
· Mechanical component and integrated assembly design through multiple iterations from early concept level to final production level
· Computer Aided Design (CAD)
· Material selection and parts design optimization for functionality, cost, and manufacturability
· Bachelor of Science in Mechanical Engineering or equivalent program
· Around 4-6 years engineering experience
· Highly skilled in Computer Aided Design (CAD) tools; creating 2D drawings and 3D models: Solidworks Preferred
· Skilled in mechanical analysis: tolerance analysis (GD&T), clash analysis, structural analysis
· Skilled in part design using sheet metal, plastic, die-cast, machining, 3D printing, and finishes
· Skilled in design for manufacturability (DFM)
· Experience with Microsoft Excel, PowerPoint, and Word
· Self-starter, self-motivated, and able to independently drive tasks to completion
· Willingness to work hands on with mechanical components
· Must be effective working in a team-based atmosphere
· Bachelor’s degree in applicable engineering discipline
· Basic understanding of server and computer architecture
· Strong and effective soft skills including verbal and written communication, problem solving/critical thinking, time management, and being a team player
· Experience writing engineering changes and bill of material structuring
· Experience extracting physical design data from Cadence circuit board ECAD models to use in mechanical CAD models of circuit cards