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This position is for a second shift semiconductor unit process packaging engineer with a focus on processes related to chemical wet cleans and thermo-compression bonding (TCB). The processing engineer will collaborate with engineers and scientists on a wide variety of wet chemical cleaning applications such as aqueous and solvent cleans, resist strips, as well as compression bonding. The candidate will be part of a team encompassing the IBM Microelectronics Research Lab (MRL), Albany Nanotech Lab (ANT), and the Quantum Assemble Lab (QAL). These facilities provide world class 200/300 mm wafer scale fabrication and packaging services to multiple clients including Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs.
- Familiarity with semiconductor and package chemical wet clean processing, along with thermo-compression bonding is essential.
- Capability to learn new processes and semiconductor packaging tools quickly is also key.
- Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughput improvement) and great yield.
- Familiarity with semiconductor and package processing related to chemical wet cleans.
- Great manual dexterity for manipulating smaller mechanical parts.
- Good organizational, communication, and presentative skills are imperative.