IBM Infrastructure has an opening for an experienced Signal and Power Integrity/System Hardware Developer Engineer. As a member of this elite team of engineering professionals, you will develop solutions through high-speed serial channel analysis and power domain analysis that enable hardware in Quantum Systems. Team members of this department impact IBM’s diverse product portfolio through involvement in high-level design support, pre-production analysis, lab validation, and model-to-hardware correlation of early user hardware.
Qualified candidates will have excellent interpersonal, communications, critical thinking, and problem-solving skills paired with knowledge of Signal and Power Integrity design processes. Additional skills include experience with signal and power integrity software such as ANSYS and Cadence tools suites and PCB design software. A strong background in electrical engineering, transmission line theory, digital signal processing, radio frequency design, and packaging and PCB materials/processes is helpful.
· Perform strategic analysis on pre-production hardware designs utilizing commercially available and internally developed electromagnetic modelling tool suites, scripting, and transient simulation methodologies to validate and improve the performance of innovative high-performance high-quality future designs supporting IBM business goals focused on the Quantum brand.
· Develop and execute laboratory verification/characterization on early user hardware, enabling model-to-hardware correlation to add value to future hardware designs.
· Perform laboratory measurements utilizing an oscilloscope, Phase Noise Analyzer, VNA, and TDR.
· Collaborate with cross-site/cross-geo teams and leadership to establish and refine strategy for tackling aggressive product goals and schedules.
· Continuously innovating design and development processes with the department and utilizing Agile best practices.
· 3-5 years of industry work experience in Signal and Power Integrity analysis, including both time-domain and frequency-domain assessment of signaling channels and Power Distribution Networks
· Familiarity with Microprocessor and ASIC 1st Level Chip Packaging and Hardware Development
· Demonstrated experience in technical execution
· Demonstrated excellence in communication skills
· Eagerness to learn, demonstrating a growth mindset
· Ability to proactively solve problems independently and in a team environment
· Comprehensive understanding of Microprocessor, ASIC, Signal and Power Integrity, 1st Level Chip Packaging, and hardware development engineering processes
· Experience with one or more programming skills such as Python, Skill, Perl, C++, Matlab
· Comprehensive skills with signal and power integrity simulation software tools
· Demonstrated ability to develop peer, cross-functional, and-cross business relationships to maximize collaboration and team effectiveness
· Demonstrated ability to work and excel in a fast-paced, dynamic, and constantly changing work environment